• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a capacitive block 1, in particular for electrical equipment, comprising a housing 2, a capacitive element housed in the housing 2, a substance 4 filling the space between the housing 2 and the capacitive element so as to produce a sealing of the capacitive element, a heat sink 5 against which the capacitive element is in direct contact. In the capacitive block 1, the heat sink 5 is different from the filling substance 4, one face of said heat sink 5, called free face 6, forming an external face of the capacitive block 1 and being devoid of said filling substance 4.
    公开号:FR3085577A1
    申请号:FR1857943
    申请日:2018-09-04
    公开日:2020-03-06
    发明作者:Baptiste Parigot；Alwin Moceri；Mathieu DIHAL
    申请人:Valeo Siemens eAutomotive France SAS；
    IPC主号:
    专利说明:

    Capacitive block including a heat sink
    The present invention relates to a capacitive block, in particular for electrical equipment, for example on board a motor vehicle. Such electrical equipment can be an inverter, a voltage converter or an electric battery charger.
    Typically, during operation, a capacitor is subjected to temperature variations which, when surrounded by air, can cause moisture in the surrounding air to condense. Such condensation water can hinder the proper functioning of the capacity. A sealed arrangement is therefore necessary. In general, the capacity is embedded in a polymerizable resin. Such a resin is poured in a fluid state around the capacity, then polymerized to take a solid state. Such a polymerization can be carried out by heat in an oven. Thus, the resin completely surrounds the capacity in a sealed manner. This resin is also an electrical insulator.
    In addition, the capacities are components used in inverters, voltage converters or on-board electrical chargers. In particular in electric or hybrid vehicle applications, the electric currents can have high intensities. The generation of heat by Joule effect can then become important at the risk of damaging the capacity. To prevent heat degradation, a condenser cooling system is required. Such a system is known from the publication of patent application US2010 / 0259898, in which the heat dissipation of the capacitor is carried out through the resin. Unfortunately, in the context of an electric or hybrid vehicle, the resin does not have sufficient thermal conductivity. For example, a resin has a thermal conductivity between 0.5 W / m.K and 1 W / m.K. As a result, heat cannot be dissipated quickly and efficiently.
    An efficient cooling system is therefore sought for the capacitors, in particular a way of dissipating the heat of the capacitor in a rapid and efficient manner.
    To this end, the present invention relates to a capacitive block, in particular for electrical equipment, comprising:
    - a housing,
    - a capacitive element housed in the housing,
    - a substance filling the space between the housing and the capacitive element so as to seal the capacitive element,
    a heat sink against which the capacitive element is in direct contact, a capacitive block in which the heat sink is different from the filling substance, one face of said heat sink, known as the free face, forming an external face of the capacitive block and being devoid of of said filling substance.
    Thus, in the capacitive block according to the invention, the heat dissipation is not effected through the filling substance, but through a heat sink directly in contact with the capacitive element. The capacitive block therefore dissipates heat more effectively than in the prior art. In particular, the capacitive element is in direct contact with the heat sink. In other words, the capacitive block is devoid of filling substance between the capacitive element and the heat sink. In particular, the filling substance is fluid when the case is filled, then becomes solid after a polymerization step. In particular, the filling substance is a polymerizable substance, such as a polymerizable resin for example.
    According to one aspect of the present invention, the heat sink has a higher thermal conductivity than that of the filling substance. Thus, the better thermal conductivity of the heat sink makes it possible to guide the heat to a cooling circuit against which the free face of the heat sink can come, and thus to accelerate the heat exchange compared to the prior art. In particular, the free face of the heat sink forms a smooth and flat surface configured to come against a corresponding face of a cooling circuit. This avoids the presence of air pockets between the heat sink and the cooling circuit against which the free face comes. The plate is for example metallic.
    According to another aspect of the invention, the heat sink comprises a plate, one face opposite to the capacitive element forms said free face of the heat sink.
    According to another aspect of the present invention, the plate has two opposite faces connected by an edge extending transversely to these two faces. One side of the plate includes the free side of the heat sink. In particular, the face of the plate opposite the free face bears against the capacitive element, in particular directly or indirectly by means of a thermally conductive and dielectric layer different from the filling substance. According to another aspect of the present invention, the filling substance comes into contact with the edge of the plate. In other words, the filling substance comes against the thickness of the plate. The filling substance comes into contact with the edge of the plate in particular over a height greater than or equal to 2mm from the face of the plate in contact with the capacitive element. Such a contact height of the filling substance over at least a portion of the thickness of the plate makes it possible to guarantee sealing around the plate and thus to prevent moisture infiltration around the plate up to 1 capacitive element.
    In particular, the heat sink and the capacitive element are held together by the solidified filling substance. This is particularly the case when the filling substance is a polymerizable substance, such as a polymerizable resin for example. Thus, the filling substance contributes at least in part to keeping the heat sink and the capacitive element together. Thus, the capacitive block forms a single manipulable object.
    According to another aspect of the invention, the filling substance extends to a height less than the height of the free face of the heat sink, said heights being defined relative to a bottom of the housing. In particular "height" is understood as a distance measured from the bottom of the housing in the direction of stacking of the parts, in particular in a direction in which the heat sink comes against the capacitive element, then a cooling circuit comes against the heatsink. Thus, when the capacitive block is brought against a cooling circuit, by a side comprising the free face of the dissipator, the free face comes against the cooling circuit, no elevation of the filling substance prevents contact of the free face with the cooling circuit. Effective heat dissipation from the heat sink to the cooling circuit can therefore be achieved.
    According to another aspect of the present invention, the heat sink has a thermally conductive and dielectric interface layer. The interface layer forms a contact between the heat sink and the capacitive element. In particular, the interface layer is between the capacitive element and said plate. The dielectric nature of the interface layer prevents a short circuit between the capacitive element and the heatsink plate, while its thermal conductivity allows efficient dissipation of heat. In particular, its thermal conductivity is higher than that of the filling substance. In particular, the interface layer is a sheet of dielectric material, preformed and attached. According to another aspect of the present invention, the interface layer has an overhanging portion around said plate. In other words, the interface layer protrudes all around the heatsink plate. This is particularly advantageous when the plate is capable of producing a short circuit with the capacitive element. The protruding portion of the interface layer prevents the creation of an electric arc between the capacitive element and the heatsink plate. The projecting portion increases the line of flight between the plate and the capacitive element.
    According to another aspect of the present invention, the capacitive element comprises at least one electrical connection tab. The tab forms a contact face of the capacitive element with the heat sink. The tab is electrically connected to an electrode of the capacitive element by a face opposite its contact face. Thus, the electrical connection tab is directly in contact with the heat sink, which effectively dissipates heat produced in the electrical connection tab. In addition, the positioning of the connection tab on the same side as the heat sink makes it possible to limit a dimension of the capacitive block on an adjoining side.
    According to another aspect of the present invention, the housing comprises a wall forming a bottom of the housing. From the bottom of the housing, the walls extend so as to form side walls of the housing. The bottom and the side walls define a housing receiving the capacitive element. One side of the capacitive element, opposite the bottom of the housing, forms a side coming directly against the heat sink. The housing therefore serves as a container for the capacitive element and the filling substance. The capacitive block is thus electrically isolated and forms an element that is easy to integrate into electrical equipment.
    The invention also relates to an assembly comprising a capacitive block according to the invention, which is assembled with a cooling circuit. The cooling circuit is configured to receive a fluid intended to drain the heat from the capacitive block. The free face of the heat sink comes against one face of said cooling circuit. The cooling circuit notably includes channels configured to receive a cooling fluid, in particular a liquid, so as to cool the capacitive block. The contact between the free face of the heat sink and the cooling circuit allows efficient heat dissipation.
    According to one aspect of the invention, the free face of the heat sink is in direct contact with the cooling circuit.
    According to another aspect of the invention, a second layer of thermally conductive and dielectric interface is disposed between the free face of the heat sink and the cooling circuit. In particular, the second interface layer is inserted between said plate and a portion of the cooling circuit against which the plate comes to bear. In particular, the interface layer is a sheet of insulating and dielectric material, preformed and attached. Alternatively, the interface layer may be a substance, for example a thermal grease, having a higher thermal conductivity than that of the filling substance.
    Alternatively, the second interface layer can be a substance, such as thermal grease, having a higher thermal conductivity than that of the filling substance.
    The present invention also relates to a method for assembling a capacitive block comprising:
    - the positioning of a capacitive element in a housing through an opening in the housing,
    - the positioning of a heat sink against a face of the capacitive element facing said opening of the housing,
    the deposition of a filling substance sealing the capacitive element by filling the space between the capacitive element and the housing, with the exception of an area comprising one face of the heat sink, known as the free face, which is opposite to the capacitive element and which forms an external face of the capacitive block.
    The assembly process ensures on the one hand the sealing of the capacitive element, and on the other hand it allows the integration of a heat sink in the capacitive block, this heat sink comprising a free face, ready to be assembled to a cooling circuit.
    The invention will be better understood and other details, characteristics and advantages of the invention will appear on reading the following description given by way of nonlimiting example with reference to the appended figures in which:
    FIG. 1 illustrates an exploded view of an example of a capacitive block according to the invention.
    FIG. 2 illustrates a perspective view of the capacitive block of FIG. 1.
    Figure 3 illustrates a sectional view of the capacitive block of Figure 1 arranged with a cooling circuit.
    The capacitive block 1, as illustrated in FIGS. 1 to 3 comprises, a housing 2 and a capacitive element 3, housed in the housing 2, a substance 4 filling the space between the housing 2 and the capacitive element 3 of so as to seal the capacitive element 3, and a heat sink 5 against which the capacitive element 3 is in direct contact. The heat sink 5 is different from the filling substance 4. The heat sink 5 also has a face, known as the free face 6, which forms an external face of the capacitive block 1 and which is devoid of the filling substance 4.
    In the example shown, the heat sink 5 has a higher thermal conductivity than that of the filling substance 4. Thus, the better thermal conductivity of the heat sink 5 makes it possible to guide the heat to a cooling circuit 13 against which the free face 6 of the heat sink 5. Compared to the prior art, the heat exchange is therefore improved. In particular, the free face 6 of the heat sink 5 forms a smooth and flat surface configured to come against a corresponding face of the cooling circuit 13. This avoids the presence of air pockets between the heat sink 5 and the cooling circuit 13 against which comes the free face 6. The plate 7 is for example metallic.
    Thus, in the capacitive block 1 according to the invention, the heat dissipation does not take place through the filling substance 4, but through the heat sink 5 directly in contact with the capacitive element 3. The capacitive block 1 therefore dissipates heat more effectively than in the prior art. In particular, the capacitive element 3 is in direct contact with the heat sink 5. In other words, the capacitive block 1 is devoid of filling substance 4 between the capacitive element 3 and the heat sink 5.
    In particular, the filling substance 4 is fluid when the housing 2 is filled, then becomes solid after a polymerization step. In particular the filling substance 4 is a polymerizable substance, such as a polymerizable resin for example. Indeed, its liquid state allows the filling substance 4 to be introduced into any free space between the capacitive element 3 and the interior wall of the housing 2. In order to seal the filling substance 4 surrounds the element capacitive 3 at least over its entire height h.
    In the example shown, the heat sink 5 may include a plate 7, one face opposite to the capacitive element 3 forms the free face 6 of the heat sink 5.
    The plate 7 may have two opposite faces connected by an edge 16 extending transversely to these two faces. In particular, one face of the plate comprises the free face of the heat sink 5. In particular, the face of the plate opposite the free face 6 comes to bear against the capacitive element, in particular directly or indirectly by means of a thermally conductive and dielectric layer 9 different from the filling substance 4.
    The filling substance 4 comes in particular into contact with the edge 16 of the plate 7. In other words, the filling substance 4 comes against the thickness of the plate 7. The filling substance 4 comes into contact with the edge 16 of the plate 7 in particular over a height greater than or equal to 2mm from the face of the plate 7 in contact with the capacitive element 3. Thus, the sealing around the plate 7 is achieved and moisture infiltration is avoided around the plate 7 to the capacitive element 3.
    In particular, the heat sink 5 and the capacitive element 3 are held together by the solidified filling substance 4. This is particularly the case when the filling substance 4 is a polymerizable substance, such as a polymerizable resin for example. Thus, the filling substance 4 contributes at least in part to keeping the heat sink 5 and the capacitive element 3 together. Thus, the capacitive block 1 forms a single manipulable object.
    In the example shown, the filling substance 4 extends to a height less than the height of the free face 6 of the heat sink 5, said heights being defined relative to a bottom 8 of the housing 2. Thus, when the block capacitive 1 is brought against a cooling circuit 13, by a side comprising the free face 6 of the dissipator 5, the free face 6 comes against the cooling circuit 13, no elevation of the filling substance 4 prevents contact of the free face 6 with the cooling circuit 13. An effective heat dissipation from the heat sink 5 to the cooling circuit 13 can therefore be obtained.
    The heat sink 5 may include an interface layer 9 which is thermally conductive and dielectric. The interface layer 9 forms a contact of the heat sink 5 with the capacitive element 3. In particular, the interface layer 9 is inserted between the capacitive element 3 and said plate 7. The dielectric nature of the interface layer 9 prevents a short circuit between the capacitive element 3 and the plate 7 of the heat sink 5, while its thermal conductivity allows effective heat dissipation. In particular, its thermal conductivity is higher than that of the filling substance 4. In particular, the interface layer 9 is a sheet of insulating and dielectric material, preformed and attached. As a variant, the interface layer 9 can be a thermal substance, having a thermal conductivity greater than that of the filling substance 4. The interface layer 9 can be a thermal grease, applied to the capacitive element 3 or to plate 7 of the heat sink 5.
    According to a variant, the interface layer 9 has a projecting portion 15 around the plate 7. In other words, the interface layer 9 protrudes all around the plate 7 of the heat sink 5. This is particularly advantageous when the plate 7 is likely to cause a short circuit with the capacitive element 3. The projecting portion 15 of the interface layer 9 prevents the creation of an electric arc between the capacitive element 3 and the plate 7 of the heat sink 5.
    In particular, the capacitive element 3 comprises at least one tab 10 for electrical connection. The tongue 10 forms a contact face of the capacitive element 3 with the heat sink 5. The tongue 10 is electrically connected to an electrode of the capacitive element 3 by a face opposite to its contact face. Thus, the electrical connection tab 10 is directly in contact with the heat sink 5, which makes it possible to efficiently dissipate heat produced in the electrical connection tab 10. In addition, the positioning of the connection tab 10 on the same side as the heat sink 5 makes it possible to limit a dimension of the capacitive block 1 on an adjoining side. The tongue 10 is in particular a part of an electrical connection bar 11. The electrical connection bar 11 allows electrical connection of the capacitive block to other electrical elements, in particular to an electronic power module. The electrical connection bar 11 comprises in particular a part 11a intended to come against the terminals of other electrical equipment. In particular, this part 11 a is positioned offset relative to the contact face 6 of the heat sink 5, in particular relative to the plate 7, so as not to hinder the contact between the heat sink 5, in particular the plate 7 , and the cooling circuit 13.
    In particular, the shape of the housing 2 is adapted to the external shape of the capacitive element 3. The example illustrated shows a housing 2 in the form of a straight block with rounded corners. The housing 2 comprises in particular a wall forming a bottom 8 of the housing 2. From the bottom 8 of the housing 2 walls 12 extend so as to form lateral walls 12 of the housing 2. The bottom 8 and the lateral walls 12 define a housing receiving the capacitive element 3. A face of the capacitive element 3, opposite the bottom 8 of the housing 2 forms the face coming directly against the heat sink 5. The housing 2 therefore serves as a container for the capacitive element 3 and the filling substance 4. The capacitive block 1 is thus electrically insulated and therefore forms an element which is easy to integrate into electrical equipment. However, the housing 2 could have another shape depending on the shape of the capacitive element 3. The shape of the housing 2 allows the capacitive element 3 and a layer of the filling substance 4 to be entirely received over the entire height h of the capacitive element 3. In particular, the filling substance 4 surrounds the capacitive element 3 entirely, in particular between the capacitive element 3 and the bottom 8 and side walls 12 of the housing 2. The thickness of the layer of substance filling 4 is in particular equal between the capacitive element 3 and the walls 12 of the housing 2.
    In order to facilitate the introduction of the filling substance in the fluid state into the housing 2, the housing 2 is provided with a protrusion 18 in one of the side walls 12. The protrusion 18 has in particular the form of an inclined notch .
    In the example shown, the heat sink 5 may be at a distance from an internal wall of the housing 2. When the capacitive block 1 is mounted in electrical equipment, this makes it possible to limit the risk of the occurrence of a short- circuit with a component close to the capacitive block 1 through a wall of the housing 2.
    Figure 3 shows in section the arrangement of the capacitive block 1 to the cooling circuit 13. A second interface layer 17 can be arranged between the cooler 13 and the plate 7. This second interface layer 17 improves the contact of the surfaces of the cooling circuit 13 and of the plate 7. This second interface layer 7 has characteristics similar to those of the first interface layer 9.
    In a variant, not shown, the free face 6 of the heat sink 5 can be provided with protrusions, in particular forming fins or cooling pins. These growths penetrate directly into the cooling circuit 13 to be washed by the cooling fluid. The protuberances are in particular distributed over the entire free face 6 of the plate 7, with the exception of a flat strip at the periphery. The cooling circuit therefore has an opening capable of surrounding the protuberances. The edge of this opening is placed on the flat strip of the plate 7. The edge of the opening of the cooling circuit may have a groove, in which a seal is received. The seal seals the assembly between the cooling circuit and the plate 7, in order to prevent any leakage of the coolant.
    References :
    Capacitive block 1 Housing 2 Capacitive element 3 Filling substance 4 Heatsink 5 Free face 6 Plate 7 Background 8 First interface layer 9 Tongue 10 Electrical connection bar 11 Side walls 12 Cooling system 13 Circuit face 14 Overflowing portion 15 Edge 16 Second interface layer 17 Filling notch 18
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    Claims
    1. Capacitive block (1), in particular for electrical equipment, comprising
    - a housing (2),
    - a capacitive element (3) housed in the housing (2),
    - a substance (4) filling the space between the housing (2) and the capacitive element (3) so as to seal the capacitive element (3),
    - a heat sink (5) against which the capacitive element (3) is in direct contact, capacitive block (1) in which the heat sink (5) is different from the filling substance (4), one side of said heat sink (5), said free face (6), forming an external face of the capacitive block (1) and being devoid of said filling substance (4).
    [2" id="c-fr-0002]
    2. Capacitive block (1) according to claim 1, wherein the heat sink (5) has a thermal conductivity greater than that of the filling substance (4).
    [3" id="c-fr-0003]
    3. Capacitive block (1) according to claim 1 or 2, wherein the heat sink (5) comprises a plate (7), one face opposite to the capacitive element (3) forms said free face (6) of the heat sink (5).
    [4" id="c-fr-0004]
    4. Capacitive block (1) according to one of the preceding claims, in which the filling substance (4) extends to a height less than the height of the free face (6) of the heat sink (5), said heights being defined relative to a bottom (8) of the housing (2).
    [5" id="c-fr-0005]
    5. Capacitive block (1) according to one of the preceding claims, in which the heat sink (5) comprises an interface layer (9) thermally conductive and dielectric forming a contact of the heat sink (5) with the capacitive element ( 3).
    [6" id="c-fr-0006]
    6. Capacitive block (1) according to claims 5 and 3, wherein said interface layer (9) has an overhanging portion (15) around said plate (7).
    [7" id="c-fr-0007]
    7. Capacitive block (1) according to one of the preceding claims, in which the capacitive element (3) comprises at least one tongue (10) for electrical connection, said tongue (10) forming a contact face of the element. capacitive (3) with the heat sink (5) and said tab (10) electrically connecting to an electrode of the capacitive element (3) by a face opposite to its contact face.
    [8" id="c-fr-0008]
    8. Capacitive block (1) according to one of the preceding claims, in which the housing (2) comprises a wall forming a bottom (8) of the housing (2), from which walls (12) extend forming walls (12) lateral of the housing (2), said bottom (8) and said side walls (12) defining a housing receiving said capacitive element (3), and a face of the capacitive element (3) opposite the bottom (8) of the housing (2) forming a face coming directly against the heat sink (5).
    [9" id="c-fr-0009]
    9. Assembly comprising a capacitive block (1) according to one of the preceding claims assembled with a cooling circuit (13) which is configured to receive a fluid intended to drain the heat from the capacitive block (1) said free face (6) of the heat sink (5) coming against a face (14) of said cooling circuit (13).
    [10" id="c-fr-0010]
    10. Method for assembling a capacitive block (1) comprising:
    - the positioning of a capacitive element (3) in a housing (2) through an opening in the housing,
    - the positioning of a heat sink (5) against a face of the capacitive element (3) facing said opening of the housing,
    - the deposition of a substance (4) sealing the capacitive element (3) by filling the space between the capacitive element (3) and the housing, with the exception of an area comprising one face of the heat sink (5), said free face (6), which is opposite to the capacitive element (3) and which forms an external face (6) of the capacitive block (1).
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    同族专利:
    公开号 | 公开日
    US20200075239A1|2020-03-05|
    EP3621093A1|2020-03-11|
    US10658110B2|2020-05-19|
    FR3085577B1|2020-10-02|
    CN110875146A|2020-03-10|
    引用文献:
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    JP6347768B2|2015-01-22|2018-06-27|カルソニックカンセイ株式会社|Capacitor structure|CN111033654B|2017-03-24|2021-07-02|法雷奥西门子新能源汽车有限公司|Inverter, capacitor module and method for assembling capacitor module|
    FR3090182B1|2018-12-14|2021-01-01|Valeo Siemens Eautomotive France Sas|Electrical equipment comprising an insulating film folded back on itself|
    DE102020202963A1|2020-03-09|2021-09-09|Zf Friedrichshafen Ag|DC link capacitor and manufacturing process|
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    法律状态:
    2019-09-26| PLFP| Fee payment|Year of fee payment: 2 |
    2020-03-06| PLSC| Search report ready|Effective date: 20200306 |
    2020-09-14| PLFP| Fee payment|Year of fee payment: 3 |
    2021-09-30| PLFP| Fee payment|Year of fee payment: 4 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1857943A|FR3085577B1|2018-09-04|2018-09-04|CAPACITIVE BLOCK INCLUDING A THERMAL SINK|
    FR1857943|2018-09-04|FR1857943A| FR3085577B1|2018-09-04|2018-09-04|CAPACITIVE BLOCK INCLUDING A THERMAL SINK|
    EP19193053.6A| EP3621093A1|2018-09-04|2019-08-22|Capacitive block comprising a heat sink|
    US16/553,673| US10658110B2|2018-09-04|2019-08-28|Capacitive block including a heat sink|
    CN201910812553.XA| CN110875146A|2018-09-04|2019-08-30|Capacitor block, assembly including the same, and method of assembling the same|
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